Category: IPC

Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1
standard by Association Connecting Electronics Industries, 08/01/2004

Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
Handbook / Manual / Guide by Association Connecting Electronics Industries, 08/01/1996

Design and Assembly Process Implementation for BGAs, with Amendment 1
standard by Association Connecting Electronics Industries, 06/01/2019

Handbook on Adhesive Bonding in Electronic Assembly Operations
standard by Association Connecting Electronics Industries, 11/01/2015

Design and Application Guidelines for Surface Mount Connectors
standard by Association Connecting Electronics Industries, 01/01/1990

Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 04/01/2010

Conflict Minerals Data Exchange Standard
Amendment by Association Connecting Electronics Industries, 05/08/2017

Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies
standard by Association Connecting Electronics Industries, 07/01/2017

Space and Military Avionics Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards
Amendment by Association Connecting Electronics Industries, 2020

Design Guide for High-Speed Controlled Impedance Circuit Boards
standard by Association Connecting Electronics Industries, 03/01/2004

Design and Assembly Process Implementation for Embedded Components
standard by Association Connecting Electronics Industries, 02/01/2015

Materials Declaration Management with Amendments 1 & 2
standard by Association Connecting Electronics Industries, 02/01/2014