API TR 17TR8

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The scope of this technical report is to provide design guidelines for oil and gas subsea equipment utilized in high-pressure high-temperature (HPHT) environments (see 3.1.24). For the purpose of the technical report, HPHT environments are intended to be one or a combination of the following well conditions:
1) the completion of the well requires completion equipment or well control equipment assigned a pressure rating greater than 15,000 psia (15 ksi, 103.5 MPa) or a temperature rating greater than
350 °F (177 °C);
2) the maximum anticipated surface pressure including shut-in tubing pressure is greater than 15,000 psia (15 ksi, 103.5 MPa) on the seafloor for a well with a subsea wellhead or at the surface for a well with a surface wellhead; or
3) the flowing temperature is greater than 350 °F (177 °C) on the seafloor for a well with a subsea wellhead or at the surface for a well with a surface wellhead.

Product Details

Edition:
3rd
Published:
07/01/2022
Number of Pages:
113
File Size:
1 file , 1.7 MB
Product Code(s):
G17TR803, G17TR803, G17TR803
Note:
This product is unavailable in Russia, Cuba, Syria, North Korea, Ukraine, Belarus, Iran

API TR 17TR8

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This technical report serves as a general design guideline for HPHT application. It provides design guidelines for oil and gas subsea equipment used in high-pressure high-temperature (HPHT) environments. Within this technical report, HPHT environments are meant to be one or a combination of the following well conditions:

1) The completion of the well requires completion equipment or well control equipment assigned a pressure rating greater than 15,000 psia [15 ksi, 103.43 MPa] or a temperature rating greater than 350 °F (177 °C);

2) The maximum anticipated surface pressure, including shut-in tubing pressure, is greater than 15,000 psia [15 ksi, 103.43 MPa] on the seafloor for a well with a subsea wellhead or tied back to the surface and terminated with surface-operated equipment; or

3) The flowing temperature is greater than 350 °F (177 °C) on the seafloor for a well with a subsea wellhead or tied back to the surface and terminated with surface-operated equipment.Service temperature ratings above 550 °F (288 °C) are outside the scope of this technical report.

Product Details

Edition:
2nd
Published:
03/01/2018
Number of Pages:
111
File Size:
1 file , 1.1 MB
Redline File Size:
2 files , 6.2 MB
Product Code(s):
G17TR82, G17TR82, G17TR82, G17TR82, G17TR82, G17TR82
Note:
This product is unavailable in Cuba, Iran, North Korea, Syria

API TR 17TR8

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The scope of this technical report is to provide design guidelines for oil and gas subsea equipment utilized in high-pressure high-temperature (HPHT) environments (Pressures greater than 15,000 psia [15 ksi, 103.43 MPa] and temperature greater than 350 °F (177 °C). Service temperature ratings above 550 °F (288 °C) are outside the scope of this technical report.

The scope of this technical report is limited to equipment and components identified in API documents that focus on subsea production equipment while addressing one or a combination of the following loading conditions:

  • internal and external pressure;
  • ambient and elevated operating temperatures;
  • static and dynamic mechanical loads;
  • other pressure/temperature induced loadings.

This technical report is intended to provide design guidelines for pressure-containing components, seals and fastener components that come in contact with or are immediately adjacent to wellbore fluids operating at HPHT conditions. Intra-field piping systems (e.g. steel flowline and pipeline jumpers, manifold piping, valving and connectors, intervention riser equipment) are within the scope of this technical report.

This technical report does not cover:

  • flexible pipes (bonded and unbonded);
  • oil-country tubular goods (OCTG) for drilling or completing wells;
  • downstream pipeline or production riser designs;
  • downhole component hardware that may be subject to additional application-related design constraints;
  • equipment covered by other API publications that specifically address HPHT applications;
  • structural members or ancillary equipment associated with HPHT hardware but not working in close proximity to the HPHT environment;
  • Brittle materials (i.e. essentially no plastic deformation prior to failure, etc.).

Product Details

Edition:
1st
Published:
02/01/2015
Number of Pages:
74
File Size:
1 file , 760 KB
Product Code(s):
G17TR81, G17TR81, G17TR81
Note:
This product is unavailable in Cuba, Iran, North Korea, Syria