Category: IPC

Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance Using the IPC-B-52 Test Assembly
standard by Association Connecting Electronics Industries, 10/01/2022

Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
standard by Association Connecting Electronics Industries, 10/01/2022

Requirements and Acceptance for Cable and Wire Harness Assemblies
standard by Association Connecting Electronics Industries, 10/01/2022

Reflow Oven Process Control Standard
standard by Association Connecting Electronics Industries, 08/01/2022

Design, Critical Process and Acceptance Requirements for Polymeric Applications
standard by Association Connecting Electronics Industries, 07/01/2022

Requirements for Printed Electronics Functional Dielectric Materials
standard by Association Connecting Electronics Industries, 08/01/2022

Connected Factory Exchange (CFX)
standard by Association Connecting Electronics Industries, 07/01/2022

Handbook for Press-fit Standard for Automotive Requirements and other High-Reliability Applications
Handbook / Manual / Guide by Association Connecting Electronics Industries, 04/01/2022

Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies
standard by Association Connecting Electronics Industries, 04/01/2022

Terms and Definitions for the Design and Manufacture of Printed Electronics
standard by Association Connecting Electronics Industries, 04/01/2022

Rail Transit Addendum to IPC-A-610G Acceptability of Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 03/01/2022

Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
standard by Association Connecting Electronics Industries, 04/01/2022