Category: IPC

Technical Proceedings for the Designers Learning Symposium – 2001
Conference Proceeding by Association Connecting Electronics Industries, 07/18/2001

Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 10/01/2011

Standard for Visual Optical Inspection Aids
standard by Association Connecting Electronics Industries, 10/01/1993

Acceptability of Printed Boards
standard by Association Connecting Electronics Industries, 07/01/2004

Spherical Bend Test Method for Characterization of Board Level Interconnects
standard by Association Connecting Electronics Industries, 09/01/2011

Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001B
Handbook / Manual / Guide by Association Connecting Electronics Industries, 10/01/2005

Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
standard by Association Connecting Electronics Industries, 09/01/2013

Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages
standard by Association Connecting Electronics Industries, 09/01/2005

Design and Critical Process Requirements for Cable and Wiring Harnesses
standard by Association Connecting Electronics Industries, 12/01/2015

Implementation of Flip Chip and Chip Scale Technology
standard by Association Connecting Electronics Industries, 01/01/1996

IPC/SOLDERTEC International Conference on Lead Free Electronics "Towards Implementation of the RHS Directive" (Brussels, Belgium – June 2003)
Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003

Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 01/01/1995