This part of IEC 62899 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.
Product Details
- Edition:
- 1.0
- Published:
- 08/01/2023
- ISBN(s):
- 9782832273289
- Number of Pages:
- 18
- File Size:
- 1 file , 670 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus